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2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Package Dimensions
Figure 14: 168-Ball FBGA – 12mm x 12mm (Package Code LE)
Seating plane
168X ?0.362
Dimensions apply to
solder balls post-reflow
on ?0.28 SMD ball pads.
Solder ball material:
A
0.1 A
SAC105 (98.5% Sn,
Ball A1 ID
Ball A1 ID
1% Ag, 0.5% Cu).
22 20 18 16 14 12 10 8 6 4 2
23 21 19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
12 ±0.1
11.0 CTR
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
0.5 TYP
Note:
0.5 TYP
11.0 CTR
12 ±0.1
1. All dimensions are in millimeters.
0.9 ±0.1
0.27 MIN
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
27
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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